A well-formed THT solder joint ensures reliable electrical connections, preventing failures and malfunctions. Here is a step-by-step guide on how to hand solder a THT component to secure good electrical conductivity.
01 – Always use the lowest possible temperature according to the mass around your component. (see note #1)
02 – Ensure your tip is properly tinned and clean of oxide.
03 – Touch the pin with solder and add more solder wire between the tip and the components so that the solder melts.
04 – Withdraw the solder wire while keeping the tip in the same position for a few seconds, allowing the molten solder to be uniformly distributed on the component and the pad. (see note #2)
05 – After a few moments, lift the soldering tip and allow the solder to air-cool.
06 – Check that the menisci have formed properly between the component and the pad.
Note #1: More mass will implied more temperature
Note #2: The presence of bubbles is a good sign; this means that the solder is flowing down the through-hole joint.
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